雜志介紹

Cirp Journal Of Manufacturing Science And Technology雜志介紹

《Cirp Journal Of Manufacturing Science And Technology》是一本以English為主的未開放獲取國際優秀期刊，中文名稱Cirp制造科學與技術雜志，本刊主要出版、報道工程技術-ENGINEERING, MANUFACTURING領域的研究動態以及在該領域取得的各方面的經驗和科研成果，介紹該領域有關本專業的最新進展，探討行業發展的思路和方法，以促進學術信息交流，提高行業發展。該刊已被國際權威數據庫SCIE收錄，為該領域相關學科的發展起到了良好的推動作用，也得到了本專業人員的廣泛認可。該刊最新影響因子為4.6，最新CiteScore 指數為9.1。

本刊近期中國學者發表的論文主要有：

• Laser powder bed fusion of micro-channels for the application of proton exchange membrane fuel cell bipolar plates

  Author: Lin, Kaijie; Qiao, Jingchi; Shi, Keyu; Dong, Weisong; Gu, Dongdong

• Design and characteristic investigation on straight grinding wheel tool holder with different bonds and abrasives for rotary ultrasonic grinding

  Author: Feng, Yi; Wang, Zongyan; Qin, Huibin; Guo, Ce; Wu, Xiao; Ma, Biao; Bai, Xuri

• Real-time and concurrent optimization of scheduling and reconfiguration for dynamic reconfigurable flow shop using deep reinforcement learning

  Author: Yang, Shengluo; Wang, Junyi; Xin, Liming; Xu, Zhigang

• Research on the light intensity modulation and characterizing methods of surface texture on KDP optics generated in fly-cutting and micro ball-end milling processes

  Author: Liu, Qi; Cheng, Jian; Liao, Zhirong; Luo, Xichun; Yang, Yue; Li, Mingquan; Yang, Hao; Tan, Chao; Wang, Guangzhou; Ding, Wenyu; Yin, Zhaoyang; Zhao, Linjie; Chen, Mingjun

英文介紹

Cirp Journal Of Manufacturing Science And Technology雜志英文介紹

The CIRP Journal of Manufacturing Science and Technology (CIRP-JMST) publishes fundamental papers on manufacturing processes, production equipment and automation, product design, manufacturing systems and production organisations up to the level of the production networks, including all the related technical, human and economic factors. Preference is given to contributions describing research results whose feasibility has been demonstrated either in a laboratory or in the industrial praxis. Case studies and review papers on specific issues in manufacturing science and technology are equally encouraged.