雜志介紹

Journal Of Micromechanics And Microengineering雜志介紹

《Journal Of Micromechanics And Microengineering》是一本以English為主的未開放獲取國際優(yōu)秀期刊，中文名稱微機(jī)械與微工程雜志，本刊主要出版、報(bào)道工程技術(shù)-ENGINEERING, ELECTRICAL & ELECTRONIC領(lǐng)域的研究動態(tài)以及在該領(lǐng)域取得的各方面的經(jīng)驗(yàn)和科研成果，介紹該領(lǐng)域有關(guān)本專業(yè)的最新進(jìn)展，探討行業(yè)發(fā)展的思路和方法，以促進(jìn)學(xué)術(shù)信息交流，提高行業(yè)發(fā)展。該刊已被國際權(quán)威數(shù)據(jù)庫SCIE收錄，為該領(lǐng)域相關(guān)學(xué)科的發(fā)展起到了良好的推動作用，也得到了本專業(yè)人員的廣泛認(rèn)可。該刊最新影響因子為2.4，最新CiteScore 指數(shù)為4.5。

本刊近期中國學(xué)者發(fā)表的論文主要有：

• Loss mechanisms of multi-frequency whispering gallery mode RF-MEMS resonators

  Author: Liu, Wenli; Chen, Zeji; Lu, Yujie; Zhao, Junyuan; Zhu, Yinfang; Yang, Jinling; Yang, Fuhua

• Remote actuation based on magnetically responsive pillar arrays

  Author: Jiang, Wei; Wang, Lanlan; Chen, Bangdao; Liu, Hongzhong

• Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors

  Author: Zhang, Yunfan; Wu, Kangkang; Shen, Shengnan; Zhang, Quanyong; Cao, Wan; Liu, Sheng

• Topology optimization design of compliant amplification mechanisms with low parasitic displacement

  Author: Wang, Qiliang; Wei, Jianming; Long, Yiping; Tan, Jianping

英文介紹

Journal Of Micromechanics And Microengineering雜志英文介紹

Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.

The journal is focussed on all aspects of:

-nano- and micro- mechanical systems

-nano- and micro- electomechanical systems

-nano- and micro- electrical and mechatronic systems

-nano- and micro- engineering

-nano- and micro- scale science

Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.

Below are some examples of the topics that are included within the scope of the journal:

-MEMS and NEMS:

Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.

-Fabrication techniques and manufacturing:

Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.

-Packaging and Integration technologies.

-Materials, testing, and reliability.

-Micro- and nano-fluidics:

Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.

-Lab-on-a-chip and micro- and nano-total analysis systems.

-Biomedical systems and devices:

Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.

-Energy and power:

Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.

-Electronics:

Including flexible electronics, wearable electronics, interface electronics.

-Optical systems.

-Robotics.